
Staff NPI Package Design Engineer
- Edinburgh
- Permanent
- Full-time
- Collaborate with cross-functional teams to drive package designs that meets Cirrus performance, reliability, and manufacturability requirements
- Define package requirements from electrical, thermal, and mechanical point of view in close cooperation with Design and layout teams
- Utilize AutoCAD, GDS tools, Siemen Fast3D and Cadence SiP Layout tool to complete physical design, electrical simulation and manufacturing validation solution for package design, including die bump array/BGA integration refinement using die information
- Drive continuous improvement processes to assure accuracy between the interface of the package to the die and PCB
- Work with cross functional teams (Customer, Designers, OSATs) to establish and maintain design rules for WLCSP, wire bond, and other packages
- Understand DFM checking and modification to improve assembly yield and prevent manufacturing issues
- Grow and promote automation processes throughout the package design flow
- Develop test vehicles that properly assess bump placement, PCB proximity effects, WLCSP RDL stack up and the like on final chip performance
- Close collaboration with customers to resolve various design issues between the piece part and PCB
- BS or above in Mechanical, Electrical, Chemical, or Materials Engineering
- Demonstrable experience in a packaging-related field
- Experienced Cadence SiP layout user
- Strong AutoCAD user
- Knowledge of packaging technologies, materials, package substrate design and assembly rules
- Understanding of electrical simulation results on a package design
- Familiarity or willingness to learn Cadence Virtuoso operation using Unix workstations
- Strong written and verbal communication skills; able to review technical ideas with customers and high-level management
- Self-starter with a strong sense of ownership and accountability for driving projects to completion
- Ability to build strong, influential relationships in a collaborative environment within a diverse setting
- Conversant with PCB and Die mechanical layout tools (e.g. Siemens Xpedition, Allegro PCB, Cadence Virtuoso)
- Broad reading in the area of interest and the desire to continue that reading with access to the high quality company library resource, material properties knowledge
- Must be broadly curious and knowledgeable, and willing to pursue mastery of new technical concepts through self-learning or training opportunities available through company resources
- Electrical simulation skills
- Experience using Siemens Fast 3D
- Experience using Siemens Calibre DRV