
Staff NPI Package Development Engineer
- Edinburgh
- Permanent
- Full-time
- Collaborate with cross-functional teams to drive package development for new products from early concept through qualification
- Cooperate frequently with domestic and overseas suppliers (manufacturing, materials, etc.)
- Ensure new and existing package solutions meet electrical, thermal, and mechanical requirements, as well as manufacturability and reliability standards
- Partner with customers, both internal and external, to establish and maintain design rules for all packaging technologies
- Develop experiments and test vehicles to evaluate and improve existing packaging technologies
- Help resolve packaging-related issues from product qualifications or the field
- Review manufacturing excursions and provide solutions to product and quality engineering teams, resulting in root cause and corrective actions
- Grow and promote automation processes throughout the package development flow
- Drive continuous improvement for systems and processes
- BS or above in Mechanical, Electrical, Chemical, or Materials Engineering
- Proven experience in a packaging-related field
- Foundation in fundamentals of Heat Transfer, Thermo-Mechanical Loading & Mechanics of Materials
- Knowledge/experience with FEA for mechanical and thermal analysis
- Knowledge/experience of material and/or process characterization
- Knowledge/experience with Six Sigma design & quality tools (Cp, Cpk, SPC, FMEA, 8D, 4D)
- Strong written and verbal communication skills; able to review technical ideas with customers and high-level management
- Self-starter with a strong sense of ownership and accountability for driving projects to completion
- Ability to build strong, influential relationships in a collaborative environment within a diverse setting
- Solid understanding of backend semiconductor manufacturing processes including photolithography, metal plating, wire/die bonding, dicing, grooving, inspection, etc.
- Solid understanding of various package types, particularly WLCSP & wire bond on both QFN and substrate-based
- Understanding of package reliability tests (uHAST, bHAST, MSL, TCT, HTS) and their failure modes & requirements
- Familiarity with automotive package qualification requirements and standards (e.g., AEC-Q100, ISO 26262)
- Experience with FEA tools (Ansys, IcePack)
- Experience with statistical/data analysis tools (JMP, R, Excel, MATLAB)